What We Actually Build

End-to-end instrument development

Most research groups can design a circuit or write firmware. Fewer can also design and fabricate the enclosure that houses it, machine or print the mechanical components that mount it, and then deploy the whole thing in a field environment where it has to work reliably without a technician nearby.

That's the capability we've built at Sunstrike. Our instrumentation work spans electronics design, microprocessor programming, 3D printing, laser cutting, and precision mechanical components — applied together, because real instruments need all of it.

This same capability underpins both our PV-Scope monitoring system and the instrumentation we use for SHINE's concentrating solar research.

Microprocessor-Based Data Acquisition

Custom firmware and hardware for measurement, logging, and real-time monitoring. Designed for the specific parameters your application requires — not adapted from a generic platform.

3D Printed Enclosures & Components

Custom enclosures designed around your electronics — not generic project boxes. We design for thermal environment, field durability, and clean assembly. Weatherized options for outdoor deployment.

Laser Cut Parts

Panels, brackets, mounting plates, and structural components cut from acrylic, plywood, or sheet stock. Rapid iteration for prototype development or small-batch production.

Fiber Optic Mounts & Holders

Precision-designed mounts and alignment fixtures for fiber optic devices — a specific area of need in concentrating solar measurement where off-the-shelf mounts rarely fit the geometry.

[ Photo: custom enclosure or 3D printed component ]
[ Photo: data logger, circuit board, or measurement setup ]

From requirement to finished instrument

01

Define the measurement requirement

What needs to be measured, at what resolution, in what environment? We start with the physical question, not the available parts.

02

Electronics and firmware design

Sensor selection, signal conditioning, microprocessor selection, and purpose-written firmware. We don't adapt generic code — we write for the application.

03

Enclosure and mechanical design

3D model the enclosure around the electronics. Design for assembly, thermal management, connector placement, and the actual deployment environment.

04

Fabricate, assemble, validate

Print, cut, assemble, and test. We validate performance against the original measurement requirement before the instrument leaves the bench.

Examples of what we've built for our own research

Need instrumentation for your solar or optics research?

We're open to discussing custom instrumentation projects that align with our work in solar and optics. Tell us what you're trying to measure.

Discuss Your Project →